Manufacturing
The Singapore production environment at Mapletree Hi-Tech Park: LED packaging, memory-module assembly, electronics integration, inspection and engineering.
Production environment
Advanced production environment
The Singapore facility was officially launched on 9 June 2026 and operates from Mapletree Hi-Tech Park. It supports LED Chip-on-Board packaging, memory-module assembly and advanced electronics manufacturing for regional and international markets.
Lines are automated with robotic handling. The intent is that quality is produced by the process itself: if the process is correct, the product is correct, and inspection confirms rather than rescues.
Capabilities
Capabilities on site
Semiconductor and LED packaging
Die attach, flip-chip assembly and Chip-on-Board build with automated placement against fiducial registration.
Automated memory-module assembly
Module lines with in-process inspection and functional test integrated into the flow.
Electronics integration
Board, driver and interconnect assembly that turns a package into a usable sub-system.
Inspection and quality control
Electrical and optical characterisation, with parts binned so a customer receives a consistent population.
Engineering and product development
Optical, thermal, electronic and package design carried out alongside production rather than remotely.
Scalable international supply
Singapore output coordinated with Group manufacturing capability where volume or capability requires it.
Production flow
How a package is built
Five stages, each one qualified before the next begins. Photography of the production floor is not published; the process is described instead.